A New Chapter for Intel Foundry Services
In 2025, Intel is making major waves in the semiconductor industry with its 18A process node securing a key foundry partnership with Microsoft. The 18A node stands out due to its adoption of next-generation RibbonFET transistors and PowerVia backside power delivery, designed to push performance and power efficiency to new heights. With risk production having started earlier this year, anticipation is high as Intel targets full-scale volume manufacturing before the year concludes. This collaboration with Microsoft underscores the industry's readiness for high-performance, US-based semiconductor manufacturing at advanced nodes.
Significance of the Microsoft Deal
Microsoft’s engagement marks the first major foundry customer for Intel’s 18A node, with the partnership expected to focus on designing leading-edge silicon for cloud and AI workloads. For Intel, this is not just about manufacturing chips but also about demonstrating that its foundry services are attractive to global tech leaders outside of its traditional product business. In a landscape where most advanced semiconductor fabrication has been dominated by non-US players, Intel’s partnership adds a valuable dimension to the future supply chain for major cloud providers.
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Looking Ahead: Enhanced 18A Variants
Intel has also revealed its roadmap beyond the base 18A process. Enhanced versions — 18A-P and 18A-PT — are scheduled for rollouts in 2026 and 2028 respectively. These variants aim to provide refinements in transistor performance and energy efficiency, further future-proofing Intel’s technologies for high-demand applications such as data centers and next-generation AI. The phased introduction of these variants indicates a commitment to continuous improvement as the company targets global foundry leadership.
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